Loading patent…
AssigneeQUALCOMM Incorporated
InventorsSanthosh Reddy Akavaram, Sang Tran, Vydhik Sharma Devaraju, Chintalapati Bharath Sai Varma, Radhakrishna Mugada, Pradeep Cherukoori
Estimating the term…
Methods and apparatuses are provided that can establish data links with greater bandwidths within die-to-die interconnect architectures. In one example, a system-on-a-chip (SoC) includes an error status register, a plurality of data ports for a data link, and a processor electrically coupled to the error status register and to the plurality of data ports. The processor can receive error data from the error status register and, based on the error data, can determine a portion of the plurality of data ports that are error free. Further, the processor can determine a bandwidth for the data link based on the portion of the plurality of data ports that are error free. Further, the processor can initiate a link negotiation process to establish the link with another device based on the link width value and the portion of the plurality of data ports that are error free.
A die comprising:
A method by a die comprising:
A non-transitory, machine-readable storage medium comprising instructions that, when executed by at least one processor, cause the at least one processor to:
Dependencies are inferred from the claim text.