Substrate processing apparatus and method thereof

A method for processing a substrate comprising:

• providing a first chemical liquid containing ozone gas;
• providing a second chemical liquid containing an OH component
• wherein the first chemical liquid and the second chemical liquid are provided to an apparatus for processing the substrate, the apparatus including,
• a substrate support unit configured to support and rotate the substrate;
• and
• a spray unit including a nozzle structure, the spray unit being configured to discharge a substrate processing liquid onto the substrate using the nozzle structure, wherein the nozzle structure comprises,
• a first inlet pipe configured to provide the first chemical liquid,
• a second inlet pipe configured to provide the second chemical liquid, and
• a plurality of reaction space modules configured to mix the first chemical liquid and the second chemical liquid;
• mixing, using the plurality of reaction space modules, the first chemical liquid and the second chemical liquid to obtain the substrate processing liquid,
• wherein the plurality of reaction space modules includes a first reaction space module and a second reaction space module fluidly connected to the first reaction space module in series, the first inlet pipe and the second inlet pipe are fluidly connected to the first reaction space module, the first inlet pipe is configured to discharge the first chemical liquid into the first reaction space module, the second inlet pipe is configured to discharge the second chemical liquid into the second reaction space module, the first reaction space module is configured to mix the first chemical liquid and the second chemical liquid, and the first reaction space module is configured to guide a mixture solution of the first chemical liquid and the second chemical liquid to the second reaction space module, and
• wherein the nozzle structure further comprises a discharge pipe fluidly connected to the second reaction space module and configured to discharge the mixture solution from the second reaction space module into the substrate processing liquid;
• and
• processing the substrate by providing the substrate processing liquid to the substrate.

An apparatus for processing a substrate, the apparatus comprising:

• a substrate support unit configured to support and rotate the substrate;
• and
• a spray unit including a nozzle structure, the spray unit being configured to discharge a substrate processing liquid onto the substrate using the nozzle structure,
• wherein the nozzle structure comprises,
• a first inlet pipe configured to provide a first chemical liquid;
• a second inlet pipe configured to provide a second chemical liquid;
• a plurality of reaction space modules configured to mix the first chemical liquid and the second chemical liquid, wherein the plurality of reaction space modules includes a first reaction space module and a second reaction space module fluidly connected to the first reaction space module in series, the first inlet pipe and the second inlet pipe are fluidly connected to the first reaction space module, the first inlet pipe is configured to discharge the first chemical liquid into the first reaction space module, the second inlet pipe is configured to discharge the second chemical liquid into the second reaction space module, the first reaction space module is configured to mix the first chemical liquid and the second chemical liquid, and the first reaction space module is configured to guide a mixture solution of the first chemical liquid and the second chemical liquid to the second reaction space module;
• and
• a discharge pipe fluidly connected to the second reaction space module and configured to discharge the mixture solution from the second reaction space module into the substrate processing liquid,
• wherein the first chemical liquid is ozone water, the ozone water including ozone gas mixed with pure water, and the second chemical liquid is an aqueous liquid including an ammonia component,
• wherein the first inlet pipe and the second inlet pipe are configured to provide the first chemical liquid and the second chemical liquid simultaneously, and a flow rate of the first chemical liquid is greater than a flow rate of the second chemical liquid, and
• wherein the second chemical liquid has a higher concentration than the first chemical liquid.