Backlight module

A backlight module comprising:

• a circuit board;
• a plurality of light-emitting elements, disposed on the circuit board and electrically connected to the circuit board, wherein the light-emitting elements comprise a first light-emitting element and a second light-emitting element;
• an optical element, wherein the light-emitting elements are disposed between the optical element and the circuit board, there is no other optical component between the optical element and the light-emitting elements, the optical element comprises a light guide portion, the light guide portion is composed of a light-transmitting material;
• at least one optical film, wherein the optical element is disposed between the at least one optical film and the light-emitting elements;
• and
• a reflective element, disposed on the circuit board, and located between the optical element and the circuit board, wherein the reflective element comprises:
• a grid portion located between the light-emitting elements, wherein the grid portion comprises a top surface and a plurality of inner side walls, the inner side walls are inclined relative to the circuit board, the top surface is higher than the light-emitting elements in a first direction, the first direction is substantially perpendicular to the circuit board, and a gap is between the grid portion and the optical element,
• wherein at least one of the inner side walls comprises:
• a first inner side wall portion, located between the optical element and the circuit board;
• and
• a second inner side wall portion located between the optical element and the first inner side wall portion, wherein the second inner side wall is inclined related to the circuit board and directly connected to the first inner side wall portion and a part of the top surface of the grid portion;
• wherein the first inner side wall portion forms a first angle with the circuit board, the second inner side wall portion forms a second angle with the circuit board, and the first angle is greater than the second angle;
• wherein the optical element further comprises:
• a first sub light incident surface and a first optical microstructure disposed on the first sub light incident surface;
• a second sub light incident surface and a second optical microstructure disposed on the second sub light incident surface;
• wherein a first arrangement density of the first optical microstructure on the first sub light incident surface is greater than a second arrangement density of the second optical microstructure on the second sub light incident surface.

A backlight module comprising:

• a circuit board;
• a plurality of light-emitting elements disposed on the circuit board and electrically connected to the circuit board, wherein the light-emitting elements comprise a first light-emitting element and a second light-emitting element;
• an optical element, wherein the light-emitting elements are disposed between the optical element and the circuit board, there is no other optical component between the optical element and the light-emitting elements, the optical element comprises a light guide portion, and the light guide portion is composed of a non-light diffusing material;
• at least one optical film, wherein the optical element is disposed between the at least one optical film and the light-emitting elements;
• and
• a reflective element disposed on the circuit board, and located between the optical element and the circuit board, wherein the reflective element comprises:
• a grid portion separating the light-emitting elements,
• wherein the reflective element has a top surface higher than the light-emitting elements in a first direction, the first direction is substantially perpendicular to the circuit board, at least one protruding pillar is disposed on the top surface, and the protruding pillar supports the optical element;
• wherein the optical element further comprises:
• a first sub light incident surface and a first optical microstructure disposed on the first sub light incident surface;
• a second sub light incident surface and a second optical microstructure disposed on the second sub light incident surface;
• wherein a first arrangement density of the first optical microstructure on the first sub light incident surface is greater than a second arrangement density of the second optical microstructure on the second sub light incident surface;
• a third sub light incident surface and a third optical microstructure disposed on the third sub light incident surface;
• wherein the third sub light incident surface is located between the first sub light incident surface and the second sub light incident surface, a third arrangement density of the third optical microstructure on the third sub light incident surface is greater than the second arrangement density of the second optical microstructure on the second sub light incident surface.