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US 12,644,907 B2Granted
Automatic wire connection apparatus for circuit board testing
AssigneeSamsung SDI Co., Ltd.
InventorImsu Choi
Life of this patent
Estimating the term…
Abstract
Provided is an apparatus for connecting a wire for circuit board testing to a circuit board and a circuit board verification apparatus, the apparatus including a probe configured to electrically connect a test point included in the circuit board to a wire for circuit board testing by soldering the wire to the test point, and a robot arm configured to place the probe at a preset position on the circuit board.
Claims8
An apparatus for connecting a wire for circuit board testing to a circuit board and a circuit board verification apparatus, the apparatus comprising:
- a probe configured to electrically connect to a test point included in the circuit board;
- a robot arm configured to place the probe at a preset position on the circuit board,
- wherein the probe includes:
- an upper probe part having a flat end and a sharp end opposite each other in a longitudinal direction of the upper probe part,
- a lower probe part having a flat end and a sharp end opposite each other in a longitudinal direction of the lower probe part, the flat end of the lower probe part being connected to the flat end of the upper probe part, and
- a spring extending from the flat end into the sharp end in each of the upper probe part and the lower probe part;
- and
- a controller electrically connected to the robot arm and to the test point, the controller being configured to adjust the probe to a minimum length when in the robot arm and to a maximum length when placed at the preset position on the circuit board, the preset position being the test point.
5 more elements
Dependencies are inferred from the claim text.