Imaging and sensing of thin layer using high-frequency ultrasonic transducers

Abstract

A system for measuring the environment using high-frequency ultrasonic pulses to interrogate thin films on the imaging surface of a CMOS integrated GHz Ultrasonic imager substrate. In one embodiment the device uses a Peltier cooler and heater chip to detect the dew point by the act of moisture condensing on the surface. Integrated temperature measurement is enabled by using some of the pixels, isolated from the environment, to be reflectors that measure the phase change in the reflected signal due to the change in the speed of sound in the silicon substrate. In another embodiment a thin film is exposed to gases, changing its ultrasonic impedance, which can be used to extract the film thickness and its ultrasonic properties.

Dependencies are inferred from the claim text.