Devices and methods for analysis of mechanical and thermal loading of structures, and methods for improving design processes for components of such structures

A device for analysis of mechanical and thermal loading of a double-pin thermo-mechanical structure, the device comprising:

• the double-pin thermo-mechanical structure comprising:
• a first member comprising a first member protruding end and a first member non-protruding end and comprising first material;
• and
• a second member comprising a second member protruding end and a second member non-protruding end and comprising second material;
• wherein the first member is at least partially between portions of the second member,
• wherein the first member is fastened to the second member,
• wherein the first material differs from the second material, and
• wherein the device is configured to mechanically load the first member and the second member by applying equal and opposite force to the first member protruding end and the second member protruding end.

A method for analysis of mechanical and thermal loading of a double-pin thermo-mechanical structure, the method comprising:

• selecting the double-pin thermo-mechanical structure comprising a first member comprising a first member protruding end and a first member non-protruding end, a second member comprising a second member protruding end and a second member non-protruding end, and a third member comprising a third member protruding end and a third member non-protruding end;
• fastening the second member to the first member and the third member to form a device for the analysis, wherein the second member is at least partially between the first member and the third member;
• thermally loading the device by raising or lowering a temperature of the first member, the second member, and the third member;
• mechanically loading the device by applying equal and opposite force to first member protruding end, the second member protruding end, and the third member protruding end;
• and
• measuring a failure load or one or more physical parameters of the device;
• wherein the first member comprises first material,
• wherein the second member comprises second material, and
• wherein the third member comprises the first material.