Method for dismantling bonded member, bonded member, and easily dismantled silicone-based liquid adhesive
AssigneeShin-Etsu Chemical Co., Ltd.
InventorNorio Kameda
Life of this patent
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Abstract
With regard to a bonded member in which a plurality of members are bonded together by a cured product obtained by curing a curable silicone-based liquid adhesive containing a hydroxide compound with a decomposition temperature of 180° C.-600° C. and a specific amount of particles which generate heat by means of microwaves, a dismantling method for the bonded member including a step in which the plurality of members are separated from each other by irradiating the cured product with microwaves and the bonded member is dismantled makes it possible to easily recycle the members.
Claims14
A method of dismantling a bonded assembly wherein a plurality of members are bonded with a cured product obtained by curing a curable liquid silicone adhesive composition comprising particles capable of generating heat upon receipt of microwave energy and a hydroxide compound having a decomposition temperature of 180 to 600° C., the content of the particles being 0.5 to 50% by weight, the method comprising the steps of:
- irradiating the microwave energy to the cured product at room temperature;
- and
- separating the plurality of members apart.
Dependencies are inferred from the claim text.