Method of bonding substrates

Abstract

A method of bonding first and second substrates to each other the substrates having respective bonding surfaces to be bonded together, comprising: (a) applying to the bonding surface of at least the first substrate a redox-active metal catalyst primer to form a primed surface; (b) activating the primed bonding surface of the first substrate by exposing the primed bonding surface to actinic radiation; (c) applying, to the so activated bonding surface of the first substrate, and/or or to the bonding surface of the second substrate, a UV curable anaerobic adhesive; (d) mating the bonding surfaces together with the UV curable anaerobic adhesive therebetween; and (e) exposing the UV curable anaerobic adhesive between the mated surfaces to actinic UV radiation. The method is particularly suited for obtaining bonds with good tensile shear strength with electrical substrates coated with an insulating varnish.

Dependencies are inferred from the claim text.