Heat-aging resistant polyamide molding compositions

A thermoplastic molding composition, comprising

• a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A;
• b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight Mn of more than 2000 g/mol as component B;
• c) 0.05 to 3 wt % of at least one sterically hindered phenol antioxidant as component C;
• d) 0.01 to 3 wt % of at least one polycarboxylic compound having more than 3 carboxylic acid groups and/or carboxylate groups, based on polyethylenimine which is N-substituted by acetic acid or acetate groups, and having a number average molecular weight Mn of more than 300 g/mol as component D;
• e) 0 to 50 wt % of at least one fibrous and/or particulate filler as component E;
• and
• f) 0 to 25 wt % of further additives as component F;
• wherein the total of wt % of components A to F is 100 wt %.