3D package for semiconductor thermal management

A 3D package for semiconductor thermal management, comprising:

• a 3D submount forming a mechanical block including at least one embedded channel formed within the mechanical block and configured to accept a cooling liquid therethrough, a first tubular connection for providing the cooling liquid to the at least one embedded channel, and a second tubular connection for removing cooling liquid from the at least one embedded channel;
• at least one semiconductor laser array die secured to the mechanical block, wherein the at least one semiconductor laser array die is kept cool by the cooling liquid flowing through the at least one embedded channel;
• a lens array and mounting holes formed in the mechanical block for securing the lens array aligned with the at least one semiconductor laser array die to produce imaging with light from pixels of the at least one semiconductor laser array die onto a blanket cylinder associated with the printing system;
• a vapor extraction unit mounted to a vapor extraction mount coupled to the 3D mechanical block and placed close to a focus area of the lens array, wherein the vapor extraction unit extracts fountain solution vapor generated by selective laser heating from a plurality of independently addressable surface emitting lasers;
• wherein the at least one semiconductor laser array die further comprises the plurality of independently addressable surface emitting lasers arranged in a linear array on a common substrate chip and including a common cathode and a dedicated channel associated with an address trace line for each laser of the plurality of independently addressable surface emitting lasers;
• and
• wherein each independently addressable semiconductor laser among the plurality of independently addressable surface emitting lasers further comprises at least one aperture operable in common with an associated address trace line to attain a larger effective aperture size, and wherein the at least one aperture further comprises a non-symmetric aperture shape configured to fit within a pitch of each address trace line associated with each channel for each of the plurality of independently addressable surface emitting lasers.

A 3D package for semiconductor thermal management, comprising:

• a 3D submount forming a mechanical block including at least one embedded channel formed within the mechanical block and configured to accept a cooling liquid therethrough, a first tubular connection for providing the cooling liquid to the at least one embedded channel, and a second tubular connection for removing cooling liquid from the at least one embedded channel;
• at least one semiconductor laser array die secured to the mechanical block, wherein the at least one semiconductor laser array die is kept cool by the cooling liquid flowing through the at least one embedded channel;
• a lens array and mounting holes formed in the mechanical block for securing the lens array aligned with the at least one semiconductor laser array die to produce imaging with light from pixels of the at least one semiconductor laser array die onto a blanket cylinder associated with the printing system;
• a vapor extraction unit mounted to a vapor extraction mount coupled to the 3D mechanical block and placed close to a focus area of the lens array, wherein the vapor extraction unit extracts fountain solution vapor generated by selective laser heating from a plurality of independently addressable surface emitting lasers;
• wherein the at least one semiconductor laser array die further comprises the plurality of independently addressable surface emitting lasers arranged in a linear array on a common substrate chip and including a common cathode and a dedicated channel associated with an address trace line for each laser of the plurality of independently addressable surface emitting lasers;
• and
• wherein each independently addressable semiconductor laser among the plurality of independently addressable surface emitting lasers further comprises at least more than one aperture operable in common with an associated address trace line to attain a larger effective aperture size.