Joint structure
AssigneeMitsui Kinzoku Company, Limited
InventorsShinichi Yamauchi, Kei Anai
Life of this patent
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Abstract
A bonded structure is a structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together. The bonding portion is made of a material mainly containing copper. In a cross section of the bonded structure taken along a thickness direction, a ratio of a bonded rate between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.9. The bonded rate is 0.3 or more.
Claims9
A bonded structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together,
- wherein the bonding portion comprises a sintered body of copper particles containing spherical copper particles and flake-like copper particles,
- a ratio (Rs/Rc) of a bonded rate Rs between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate Rc between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.8, in a cross section of the bonded structure taken along a thickness direction thereof,
- the bonded rate Rc is 0.3 or more, and
- the bonded rate Rs is 0.35 or more and 0.55 or less,
- wherein a temperature increase rate during sintering is 120 to 2000° C./min.
Dependencies are inferred from the claim text.