Semiconductor device and manufacturing method for semiconductor device
AssigneeRohm Co., Ltd.
InventorKoshun Saito
Life of this patent
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Abstract
A semiconductor device includes a first lead, a second lead, a third lead, a semiconductor element, a sealing resin and a coating layer. The sealing resin has a bottom surface and an outer side surface. The bottom surface of the sealing resin is formed with a recess having an inner side surface. The second lead includes a reverse surface exposed at the bottom surface and a side surface exposed at the outer side surface. The coating layer contains a metal element and covers the reverse surface and the side surface. The recess is located between the first lead and the second lead. The second lead and at least one of the first lead and the third lead have inner end surfaces exposed at the inner side surface.
Claims17
A semiconductor device comprising:
- a first lead;
- a second lead located next to the first lead in a direction orthogonal to a thickness direction of the first lead;
- a third lead located next to the second lead in the direction orthogonal to the thickness direction;
- a first semiconductor element mounted on the first lead and electrically connected to the second lead;
- a sealing resin covering a part of each of the first lead, the second lead and the third lead, and the first semiconductor element;
- and
- a coating layer containing a metal element, wherein
- the sealing resin includes a bottom surface facing in the thickness direction and an outer side surface connected to the bottom surface and facing outward from the sealing resin in the direction orthogonal to the thickness direction,
- the sealing resin is formed with a recess that is recessed from the bottom surface,
- the recess includes an inner side surface connected to the bottom surface and facing inward in the sealing resin in the direction orthogonal to the thickness direction,
- the second lead includes a reverse surface exposed at the bottom surface and a side surface connected to the reverse surface and exposed at the outer side surface,
- the coating layer covers the reverse surface and the side surface,
- the recess is located between the first lead and the second lead, and
- the second lead and at least one of the first lead and the third lead include inner end surfaces exposed at the inner side surface.
A method for manufacturing a semiconductor device, the method comprising the steps of:
- mounting a semiconductor element on one of a plurality of leads each including a reverse surface and a side surface connected to the reverse surface;
- and
- forming a sealing resin covering a part of each of the plurality of leads and the semiconductor element,
- the step of forming the sealing resin including exposing the reverse surface and the side surface of at least one of the plurality of leads from the sealing resin,
- at least two of the plurality of leads being connected to each other with a connecting strip having a same composition as the plurality of leads,
- the method further comprising the steps of:
- after the step of forming the sealing resin, forming by electrolytic plating a coating layer covering the reverse surface and the side surface exposed from the sealing resin and containing a metal element;
- and
- after the step of forming the coating layer, cutting the connecting strip by removing a part of the sealing resin from a side on which the reverse surface is exposed.
Dependencies are inferred from the claim text.