Package substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHungen Hsu, Wei-Tien Shen, Kuo-Ching Hsu
Life of this patent
Estimating the term…
Abstract
Embodiments provide a package substrate. The package substrate includes a substrate and a semiconductor device. The substrate includes a cavity hole therein. The semiconductor device is embedded in the cavity hole. The semiconductor device includes a first device component and a second device component. The first device component has a first pad, a second pad, and a first trench capacitor. The second device component has a third pad, a fourth pad, and a second trench capacitor. A backside of the first device component is bonded to a backside of the second device component, and the first pad has an area less than an area of the third pad, and the second pad has an area less than an area of the fourth pad.
Claims20
A package substrate comprising:
- a substrate, the substrate comprising a cavity hole therein;
- a semiconductor device embedded in the cavity hole, wherein the semiconductor device comprises:
- a first device component having a first pad, a second pad, and a first trench capacitor;
- and
- a second device component having a third pad, a fourth pad, and a second trench capacitor, wherein a backside of the first device component is bonded to a backside of the second device component, and the first pad has an area less than an area of the third pad, and the second pad has an area less than an area of the fourth pad.
A package substrate comprising:
- a substrate, the substrate comprising a cavity hole therein, through holes therein, conductive traces extending from a first side to a second side of the substrate and through sidewalls of the through holes, and a dielectric layer further filling in the through holes;
- a semiconductor device, embedded in the cavity hole, wherein the semiconductor device comprises:
- a first device component having a first pad, a second pad, a first trench capacitor, and a passivation layer on portions of the first pad and the second pad;
- a second device component having a third pad, a fourth pad, and a second trench capacitor, wherein a backside of the first device component is bonded to a backside of the second device component;
- and
- an adhesive, inserted between the backside of the first device component and the backside of the second device component;
- an encapsulation layer, laterally encapsulating the first device component, the second device component and the adhesive, wherein the encapsulation layer is in contact with sidewalls of the passivation layer, and sidewalls of the third pad and the fourth pad of the second device component;
- a first via, disposed over the substrate inside an area of the semiconductor device;
- and
- a second via, disposed over the substrate and outside the area of the semiconductor device, wherein a size of the first via is greater than a size of the second via.
A package substrate comprising:
- a substrate, the substrate comprising a cavity hole therein, through holes therein, conductive traces extending from a first side to a second side of the substrate and through sidewalls of the through holes, and a dielectric layer further filling in the through holes;
- a semiconductor device embedded in the cavity hole, wherein the semiconductor device comprises:
- a first device component having a first pad, a second pad, a first trench capacitor, and a first passivation layer on portions of the first pad and the second pad;
- and
- a second device component having a third pad, a fourth pad, a second trench capacitor, and a second passivation layer on portions of the third pad and the fourth pad, wherein a backside of the first device component is bonded to a backside of the second device component through an adhesive;
- a first via inside an area of the semiconductor device;
- and
- a second via outside the area of the semiconductor device, wherein a size of the first via is greater than a size of the second via,
- wherein the dielectric layer is in contact with sidewalls of the first device component, the second device component and the adhesive.
Dependencies are inferred from the claim text.