Multi-channel device stacking

An electronic device, comprising:

• a first integrated device assembly;
• a second integrated device assembly disposed over the first integrated device assembly;
• a first channel connected to a first circuit of the first integrated device assembly;
• and
• a second channel different from the first channel, wherein the second channel extends through the first integrated device assembly and electrically bypasses the first integrated device assembly and is connected to a second circuit of the second integrated device assembly.

An electronic device, comprising:

• a first plurality of integrated device dies;
• a second plurality of integrated device dies, wherein the first and second pluralities of integrated device dies are stacked together;
• a first channel extending at least partially through the first and second pluralities of integrated device dies, wherein the first channel is connected to circuitry in the second plurality of integrated device dies and electrically bypasses circuitry in the first plurality of integrated device dies;
• and
• a second channel extending at least partially through the first and second pluralities of integrated device dies, wherein the second channel is connected to circuitry in the first plurality of integrated device dies and electrically bypasses circuitry in the second plurality of integrated device dies.