Semiconductor device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMinki Kim, Seungduk Baek, Hyuekjae Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a base structure comprising a first bonding pad and a first test pad, and a semiconductor chip comprising a second bonding pad being in contact with the first bonding pad of the base structure and a second test pad being in contact with the first test pad of the base structure. A width of the second bonding pad of the semiconductor chip is less than a width of the second test pad of the semiconductor chip. An air gap is provided between the first test pad of the base structure and the second test pad of the semiconductor chip.
Claims12
A semiconductor device comprising:
- a base structure comprising a first bonding pad and a first test pad spaced apart in a first direction;
- and
- a semiconductor chip comprising a second bonding pad in contact with the first bonding pad of the base structure, and a second test pad in direct contact with the first test pad of the base structure, wherein:
- a portion of a surface of the first test pad is exposed,
- a portion of a surface of the second test pad is exposed, and
- the exposed portion of the surface of the first test pad and the exposed portion of the surface of the second test pad define an air gap between the first test pad of the base structure and the second test pad of the semiconductor chip, and
- wherein a width along the first direction of the second bonding pad of the semiconductor chip is less than a width along the first direction of the second test pad of the semiconductor chip.
A semiconductor device comprising:
- a base structure comprising a first bonding pad and a first test pad spaced apart in a first direction;
- and
- a semiconductor chip comprising a second bonding pad in contact with the first bonding pad of the base structure, and a second test pad in direct contact with the first test pad of the base structure,
- wherein a portion of a surface of the first test pad is exposed,
- wherein a portion of a surface of the second test pad is exposed,
- wherein the exposed portion of the surface of the first test pad and the exposed portion of the surface of the second test pad define an air gap between the first test pad of the base structure and the second test pad of the semiconductor chip,
- wherein a width along the first direction of the second bonding pad of the semiconductor chip is less than a width along the first direction of the second test pad of the semiconductor chip,
- wherein a width along the first direction of the first bonding pad of the base structure is less than a width along the first direction of the first test pad of the base structure.
Dependencies are inferred from the claim text.