Power semiconductor device and method of producing a power semiconductor device
AssigneeInfineon Technologies AG
InventorsWerner Schustereder, Roman Baburske, Hans-Joachim Schulze
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Abstract
A method of forming a laterally varying dopant concentration profile of an electrically activated dopant in a power semiconductor device includes: providing a semiconductor body; implanting a dopant to form a doped region in the semiconductor body; providing, above the doped region, a mask layer having a first section and a second section, the first section having has a first thickness along a vertical direction and the second section having a second thickness along the vertical direction, the second thickness being different from the first thickness; and subjecting the doped region and both mask sections to a laser thermal annealing, LTA, processing step.
Claims34
A method of forming a laterally varying dopant concentration profile of an electrically activated dopant in a power semiconductor device, the method comprising:
- providing a semiconductor body;
- implanting a dopant to form a doped region in the semiconductor body;
- providing, above the doped region, a mask layer having a first section and a second section, wherein the first section has a first thickness along a vertical direction and the second section has a second thickness along the vertical direction, wherein the second thickness is different from the first thickness;
- and
- subjecting each of the doped region, the first section of the mask layer, and the second section of the mask layer to a laser thermal annealing (LTA) processing step.
A method of forming a laterally varying dopant concentration profile of an electrically activated dopant in a power semiconductor device, the method comprising:
- providing a semiconductor body;
- providing, at the semiconductor body, a mask layer having a first section and a second section, wherein the first section has a first thickness along a vertical direction and the second section has a second thickness along the vertical direction, wherein the second thickness is different from the first thickness;
- implanting a dopant to form a doped region in the semiconductor body;
- and
- subjecting each of the doped region, the first section of the mask layer, and the second section of the mask layer to a laser thermal annealing (LTA) processing step,
- wherein the doped region is a body region of a transistor cell,
- wherein the LTA processing step yields both a channel region and a body contact subregion in the body region,
- wherein the body contact subregion has a higher dopant concentration than the channel region and is displaced from the channel region based on the laterally varying dopant concentration profile.
Dependencies are inferred from the claim text.