Display unit, display module, electronic device, and method for manufacturing the display unit

A method for manufacturing a display unit, comprising the steps of:

• forming a plurality of transistors in a matrix over a first substrate;
• forming a plurality of first conductive layers each of which is electrically connected to at least one of the plurality of transistors, over the plurality of transistors;
• forming a plurality of light-emitting diodes in a matrix over a second substrate;
• forming a plurality of second conductive layers each of which is electrically connected to at least one of the plurality of light-emitting diodes, over the plurality of light-emitting diodes;
• bonding the first substrate and the second substrate by directly bonding each of the plurality of first conductive layers to at least one of the plurality of second conductive layers so that each of the plurality of transistors is electrically connected to at least one of the plurality of light-emitting diodes;
• forming at least one of a coloring layer, a color conversion layer, and a touch sensor over a third substrate;
• bonding the first substrate and the second substrate and then separating the second substrate;
• and
• bonding the third substrate to a surface exposed by the separation of the second substrate.

A method for manufacturing a display unit, comprising the steps of:

• forming a plurality of transistors in a matrix over a first substrate;
• forming a plurality of first conductive layers each of which is electrically connected to at least one of the plurality of transistors, over the plurality of transistors;
• forming a plurality of light-emitting diodes in a matrix over a second substrate;
• forming a plurality of second conductive layers each of which is electrically connected to at least one of the plurality of light-emitting diodes, over the plurality of light-emitting diodes;
• bonding the first substrate and the second substrate by directly bonding each of the plurality of first conductive layers to at least one of the plurality of second conductive layers so that each of the plurality of transistors is electrically connected to at least one of the plurality of light-emitting diodes;
• forming at least one of a coloring layer, a color conversion layer, and a touch sensor over a third substrate;
• polishing the second substrate to reduce a thickness of the second substrate after the first substrate and the second substrate are bonded to each other;
• and
• bonding the third substrate to a polished surface of the second substrate.