LED chip based on alumina-silica composite substrate and fabrication method thereof
AssigneeFocus Lightings Tech Co., Ltd.
InventorsHan Jiang, Hu Cheng, Yangyang Xu, Guochang Li, Zhijun Xu, Wenjun Wang
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AssigneeFocus Lightings Tech Co., Ltd.
InventorsHan Jiang, Hu Cheng, Yangyang Xu, Guochang Li, Zhijun Xu, Wenjun Wang
Estimating the term…
The present application provides an LED chip based on an alumina-silica composite substrate and a fabrication method thereof. The LED chip comprises an alumina-silica composite PSS substrate, a composite buffer layer and an LED structural layer, wherein the composite buffer layer is epitaxially grown on the alumina-silica composite PSS substrate, and the LED structural layer is epitaxially grown on the composite buffer layer. The composite buffer layer comprises: an aluminium oxynitride/aluminium nitride layer and a silicon oxynitride layer, wherein the alumina in the alumina-silica composite PSS substrate is covered with the aluminium oxynitride/aluminium nitride layer, and the silica in the alumina-silica composite PSS substrate is covered with the aluminium oxynitride/aluminium nitride layer and the silicon oxynitride layer in a staggered manner.
An LED chip based on an alumina-silica composite substrate, comprising:
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