Circuit board, display apparatus, and method for manufacturing circuit board
AssigneesChengdu Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorFan Li
Life of this patent
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Abstract
Disclosed is a circuit board, including: a first circuit board, a second circuit board and a conductive portion. The first circuit board includes a first substrate, a wire group and a substrate connection pad. A first wire group includes a first wire and a second wire disposed on two sides of the first substrate. A first substrate connection pad is electrically connected to the second wire via a via hole. The second circuit board includes a second substrate, a wire and a relay connection pad, wherein the wire and the relay connection pad are disposed on the second substrate. One end of the wire is electrically connected to a first relay connection pad.
Claims20
A circuit board, comprising a first circuit board, at least one second circuit board and at least one conductive portion, wherein
- the first circuit board comprises a first substrate, at least one wire group and at least one substrate connection pad, wherein a first wire group in the at least one wire group comprises a first wire disposed on a first side of the first substrate and a second wire disposed on a second side of the first substrate, the at least one substrate connection pad is disposed on the first side of the first substrate, the first wire is electrically connected to a first substrate connection pad in the at least one substrate connection pad, the first substrate is provided with a first via hole, the first substrate connection pad is electrically connected to the second wire via the first via hole, and the first side and the second side are two opposite sides of the first substrate;
- and
- the second circuit board comprises a second substrate, at least two wires and at least one relay connection pad, wherein the least two wires and the at least one relay connection pad are disposed on the second substrate, the second substrate is disposed on the first side of the first substrate, one end of each of the at least two wires is electrically connected to a first relay connection pad in the at least one relay connection pad, and the first relay connection pad is electrically connected to the first substrate connection pad via a first conductive portion in the at least one conductive portion.
A display apparatus, comprising a display panel and a circuit board, wherein the display panel is electrically connected to the circuit board, the circuit board comprises a first circuit board, at least one second circuit board and at least one conductive portion, wherein
- the first circuit board comprises a first substrate, at least one wire group and at least one substrate connection pad, wherein a first wire group in the at least one wire group comprises a first wire disposed on a first side of the first substrate and a second wire disposed on a second side of the first substrate, the at least one substrate connection pad is disposed on the first side of the first substrate, the first wire is electrically connected to a first substrate connection pad in the at least one substrate connection pad, the first substrate is provided with a first via hole, the first substrate connection pad is electrically connected to the second wire via the first via hole, and the first side and the second side are two opposite sides of the first substrate;
- and
- the second circuit board comprises a second substrate, at least two wires and at least one relay connection pad, wherein the least two wires and the at least one relay connection pad are disposed on the second substrate, the second substrate is disposed on the first side of the first substrate, one end of each of the at least two wires is electrically connected to a first relay connection pad in the at least one relay connection pad, and the first relay connection pad is electrically connected to the first substrate connection pad via a first conductive portion in the at least one conductive portion.
A method for manufacturing a circuit board, comprising:
- providing a first circuit board, wherein the first circuit board comprises a first substrate, at least one wire group and at least one substrate connection pad, wherein a first wire group in the at least one wire group comprises a first wire disposed on a first side of the first substrate and a second wire disposed on a second side of the first substrate, the at least one substrate connection pad is disposed on the first side of the first substrate, the first wire is electrically connected to a first substrate connection pad in the at least one substrate connection pad, the first substrate is provided with a first via hole, the first substrate connection pad is electrically connected to the second wire via the first via hole, and the first side and the second side are two opposite sides of the first substrate;
- providing a second circuit board, wherein the second circuit board comprises a second substrate, at least two wires and at least one relay connection pad, wherein the least two wires and the at least one relay connection pad are disposed on the second substrate, and one end of each of the at least two wires is electrically connected to the first relay connection pad in the at least one relay connection pad;
- and
- stacking the second circuit board on the first circuit board, and electrically connecting the first relay connection pad to the first substrate connection pad via at least one conductive portion, wherein the second substrate is disposed on the first side of the first substrate.
Dependencies are inferred from the claim text.