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US 12,641,708 B2Granted
Electronic apparatus
AssigneeFUJIFILM Corporation
InventorYota Akashi
Life of this patent
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Abstract
An electronic apparatus includes: an electronic component; a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed; and a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, and plural conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case.
Claims16
An electronic apparatus comprising:
- an electronic component;
- a substrate including a first layer at which the electronic component and a first ground pattern are disposed, and a second layer at which a second ground pattern is disposed;
- and
- a case which is in contact with the first ground pattern, covers the electronic component, reduces magnetic noise, and is fixed to the substrate, wherein the case comprises a side wall which extends toward the first layer and is in contact with the first ground pattern,
- wherein the case is disposed such that a lower end portion of the side wall overlaps the first ground pattern as viewed from a lamination direction of the substrate,
- wherein a plurality of conductors connecting the first ground pattern and the second ground pattern are disposed along a portion of the first ground pattern, the portion being in contact with the case, and the plurality of conductors are disposed at positions corresponding to the lower end portion of the side wall of the case that overlaps the first ground pattern as viewed from the lamination direction of the substrate,
- wherein an arrangement density of the plurality of conductors varies depending on a position in a region sandwiched between the first ground pattern and the second ground pattern,
- wherein a distribution of the arrangement density of the plurality of conductors is a distribution according to a positional relationship between the electronic component and an electronic element disposed outside the case,
- wherein the region sandwiched between the first ground pattern and the second ground pattern includes a first region and a second region,
- a path in which the magnetic noise reaches the electronic element from the electronic component through the second region is shorter than a path in which the magnetic noise reaches the electronic element from the electronic component through the first region, and
- the arrangement density of the plurality of conductors is higher in the second region than in the first region.
8 more elements
Dependencies are inferred from the claim text.