Thermal riser system
AssigneeLiquacool IP LLC
InventorsNicholas J. Monahan, Clas Sivertsen
Life of this patent
Estimating the term…
Abstract
A cooling system used with a component on a printed circuit board is described. The cooling system comprises a thermal riser having a top including a plurality of thermal riser pads to receive interconnections on a bottom of the component, a bottom including a plurality of bottom connectors configured to be coupled to traces on the printed circuit board, pins coupling each thermal riser pad to a corresponding bottom connector, the pins being electrically conductive, and a transfer fluid within the thermal riser, the transfer fluid in contact with the pins to cool the interconnections of the component, and thereby cool a bottom of the component.
Claims22
A cooling system for a component on a substrate comprising a thermal riser, the thermal riser comprising:
- a thermal riser casing;
- a plurality of pins extending through the thermal riser casing, the pins having a top comprising a plurality of thermal riser pads to receive interconnection pins on a bottom of the component, and a plurality of thermal riser solder balls are configured to be coupled to pads on the substrate;
- the pins coupling each of the plurality of thermal riser pads to a corresponding thermal riser solder ball, the pins being electrically conductive;
- a transfer fluid within the thermal riser, the transfer fluid in contact with the pins to cool the interconnection pins of the component and thereby cool the bottom of the component;
- and
- a leak-proof enclosure surrounding the thermal riser and the component on the substrate, the leak-proof enclosure filled with the transfer fluid.
A thermal riser for a component on a printed circuit board comprising:
- a thermal riser casing having a top and a bottom;
- a plurality of pins extending through the thermal riser casing and extending from the thermal riser casing on the top and the bottom;
- the thermal riser configured to be placed between the component and the printed circuit board, the thermal riser to provide an electrical connection between the component and the printed circuit board;
- transfer fluid in the thermal riser casing to cool the plurality of pins, and thereby the component coupled to the pins;
- a leak-proof enclosure surrounding the thermal riser and the component on the printed circuit board, the leak-proof enclosure filled with the transfer fluid.
A thermal management system for a component on a substrate comprising:
- a thermal riser including a plurality of pins, the thermal riser configured to be placed between the component and the substrate, the pins in the thermal riser configured provide electrical connections between the component and the substrate;
- a leak-proof enclosure surrounding the thermal riser and the component on the substrate;
- and
- transfer fluid in the leak-proof enclosure and the thermal riser to cool the component.
Dependencies are inferred from the claim text.