US 12,641,040 B2Granted

Device and method with multi-stage electrical interconnection network

AssigneeSamsung Electronics Co., Ltd.

InventorsWonseok Lee, Alan Gara, Young Jun Hong, Wonyong Lee, Wooseok Chang

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Abstract

A device and method that implements a multi-stage electrical interconnection network is provided. The electronic device includes a plurality of computing devices and a plurality of switches grouped into a plurality of groups. Switches, of the plurality of switches, in a same group are configured to be fully connected to computing devices in the same group, each of switches of the plurality of switches included in a first group among the plurality of groups is configured to have a ono-to-one connection with any one of switches included in a second group, and a connection between the computing devices in the same group and the switches in the same group and a connection between switches in in the plurality of groups are electrical connections.

Claims20

Dependent claims

An electronic device, comprising:

a plurality of printed circuit boards (PCB's), each PCB of the plurality of PCB's comprising:
a plurality of switches respectively grouped into a plurality of groups;
and
a plurality of computing devices arranged in the plurality of groups;
and
a midplane printed circuit board (PCB) configured to receive each of the plurality of PCB's,
wherein switches, of the plurality of switches, in a same group of the plurality of groups, are configured to be fully connected in an electrical manner to computing devices, of the plurality of computing devices, in the same group,
wherein each of multiple switches of the plurality of switches, comprised in a first group among the plurality of groups is configured to have a one-to-one connection with one switch of the multiple switches of the plurality of switches comprised in each remaining group among the plurality of groups,
wherein communication between a first switch of the plurality of switches within a first PCB with a second switch of the plurality of switches from a different PCB occurs across the midplane PCB, and
wherein the computing devices and the switches are arranged in a printed circuit board (PCB) within a predetermined range based on a link budget of an electrical interface, and
wherein the predetermined range is a trace length less than 460 millimeters.

8 more elements

A method, comprising:

partitioning data to be transmitted from a first computing device in a first group of a plurality of groups to a second computing device in a second group of the plurality of groups, and transmitting the partitioned data to first switches in the first group based on a full connection in an electrical manner between the first computing device and each of the first switches in the first group;
transmitting the partitioned data to second switches in the second group based on an connection between the first switches in the first group and the second switches in the second group;
and
transmitting the partitioned data from the second switches to the second computing device based on a full connection between each of the second switches and the second computing device,
wherein each group of the plurality of groups comprises a respective plurality of computing devices including the first computing device in the first group and the second computing device in the second group,
wherein each one of the first switches is configured to have a one-to-one connection with a corresponding one of the second switches in each remaining group among the plurality of groups,
wherein each computing device of the plurality of computing devices including the first computing device and the second computing device are connected to respective switches of a plurality of switches including the first switches and the second switches in an electrical interconnection network, and
wherein the computing devices and the switches are arranged in a printed circuit board (PCB) within a predetermined range based on a link budget of an electrical interface, and
wherein the predetermined range is a trace length less than 460 millimeters.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/460,901Filed 5 Sep 2023 · continuation
Priority: KR 10-2022-00416984 Apr 2022
Published: US 2023/0254269 A121 Dec 2023
Granted: 26 May 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H04L 49/1515
Interconnection of switching modules: non-blocking multistage, e.g. Clos
H04Q 3/52
Circuit arrangements for indirect selecting controlled by common circuits, e.g. register controller, marker: using static devices in switching…
H04L 5/0001
Arrangements affording multiple use of the transmission path: arrangements for dividing the transmission path
H04L
Digital communication

Family

Application63/308,358Us provisional application · filed 9 Feb 2022
Application17/941,334Parent of this continuation · filed 9 Sep 2022
US 2023/0412524 A1Pre-grant publication · published 21 Dec 2023
US 12,641,039 B2Related patent
US 2023/0254269 A1Published application
US 12,641,040 B2This patent

From the US filing history. Foreign family members aren’t listed.