Compact RF front-end module and method of packaging

An integrated circuit device comprising:

• a substrate comprising a top surface, the top surface comprising a first portion, a second portion, a third portion, and a fourth portion, the second portion at least partially surrounding periphery of the first portion, the fourth portion at least partially surrounding periphery of the third portion, the second portion being adjacent to the fourth portion, the substrate comprising a first pair of windings of conductive traces positioned at a first level below the fourth portion and a second pair of windings of conductive traces positioned at a second level below the second portion;
• a first amplifier coupled onto the first portion;
• a second amplifier coupled onto the third portion;
• a first transformer based on the first pair of windings and being coupled to the first amplifier;
• and
• a second transformer based on the second pair of windings and being coupled to the second amplifier.

A method for processing an integrated circuit device, the method comprising:

• providing a substrate comprising a top surface and a thickness, the top surface comprising a least a first portion and a second portion, the second portion being adjacent to the first portion;
• laying out a first winding of conductive traces and a second winding conductive traces in the substrate at a first level below the second portion of the top surface, the first winding of conductive traces being overlapped with the second winding of conductive traces;
• laying out a third winding of conductive traces and a fourth winding conductive traces in the substrate at a second level below the first portion of the top surface, the third winding of conductive traces being overlapped with the fourth winding of conductive traces;
• forming multiple first contact pads on the first portion of the top surface, the multiple first contact pads comprising at least a first pair of output pads coupled to the first winding;
• forming multiple second contact pads on the second portion of the top surface, the multiple second contact pads comprising at least a second pair of output pads coupled to the third winding;
• disposing a first amplifier onto the first portion of the top surface, the first pair of output pads being coupled to a first differential output from the first amplifier;
• and
• disposing a second amplifier onto the second portion of the top surface, the second pair of output pads being coupled to a second differential output from the second amplifier.