Method for manufacturing light emitting device, bonding method, and light emitting device

A method for manufacturing a light emitting device comprising:

• disposing a light emitting element on a base member;
• providing a bonding agent to the base member or a lid member;
• and
• bonding the base member on which the light emitting element is disposed and the lid member with the bonding agent by
• sandwiching the bonding agent in a molten state between the base member and the lid member, and pressing the lid member against the base member,
• increasing a distance between the base member and the lid member in a state in which the lid member is pressed against the base member, while maintaining a state in which the bonding agent contacts the base member and the lid member, and
• solidifying the bonding agent in a state in which the distance between the base member and the lid member is increased to bond the base member and the lid member, wherein
• the increasing of the distance between the base member and the lid member includes pulling up the lid member from a position of the lid member in a state in which a predetermined load is exerted on the base member to a position at a predetermined height to increase the distance between the base member and the lid member.