Ultra-high vacuum seal, assembly, and method of making the same
AssigneeQuantinuum LLC
InventorsBenjamin Norman Spaun, Tyler Davis Hilbun, Riley Dewitt Ancona, Jason Anthony Fuqua
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Abstract
An ultra-high vacuum seal assembly includes a circuit board, a first ring, and a second ring. The first ring and the second ring include indium. The circuit board includes a first surface and a second surface that is opposite the first surface. The circuit board also includes a via array that is in electrical communication with the first surface and the second surface of the circuit board. The first ring is positioned directly on the first surface of the circuit board and the second ring is positioned directly on the second surface of the circuit board.
Claims20
An ultra-high vacuum assembly for a quantum computer, the ultra-high vacuum assembly comprising:
- a plate;
- an enclosure;
- and
- an ultra-high vacuum seal assembly positioned between the plate and the enclosure, wherein the ultra-high vacuum seal assembly comprises:
- a circuit board comprising a first surface and a second surface that is opposite the first surface, wherein the circuit board further comprises a via array that is in electrical communication with the first surface and the second surface;
- a first ring positioned directly on the first surface of the circuit board;
- and
- a second ring positioned directly on the second surface of the circuit board, wherein the first ring and the second ring comprise indium (In).
An ultra-high vacuum seal assembly for a quantum computer, the ultra-high vacuum seal assembly comprising:
- a circuit board comprising a first surface and a second surface that is opposite the first surface, wherein the circuit board further comprises a via array that is in electrical communication with the first surface and the second surface;
- a first ring positioned directly on the first surface of the circuit board;
- and
- a second ring positioned directly on the second surface of the circuit board, wherein the first ring and the second ring comprise indium (In).
A method of manufacturing an ultra-high vacuum seal assembly, the method comprising:
- forming a via array on a substrate such that the via array is in electrical communication with a first surface and a second surface of the substrate;
- preparing at least a portion of a first ring and at least a portion of a second ring with an acid, wherein the first ring and the second ring comprise indium (In);
- and
- pressing the first ring on the first surface of the substrate and pressing the second ring on the second surface of the substrate, wherein the first surface of the substrate is opposite the second surface of the substrate.
Dependencies are inferred from the claim text.