Mounting substrate, blanking aperture array chip, blanking aperture array system and multi charged particle beam irradiation apparatus

A mounting substrate which is to be installed on a multi charged particle beam irradiation apparatus, and on which a blanking aperture array chip provided with blanking electrodes to perform blanking deflection on beams in a multi charged particle beam is mounted, the mounting substrate comprising:

• an opening through which the multi charged particle beam passes;
• a plurality of control circuits a control signal to the blanking electrodes for each of a plurality of areas into which the blanking aperture array chip is divided;
• and
• grounds, each of which is provided for a corresponding one of the plurality of control circuits and configured to supply a ground electrical potential to the corresponding control circuit, wherein
• a first control circuit and a second control circuit are provided as the plurality of control circuits,
• a first ground corresponding to the first control circuit includes a plurality of first ground layers which are stacked, and the plurality of first ground layers are connected through a first via,
• a second ground corresponding to the second control circuit includes a plurality of second ground layers which are stacked, and the plurality of second ground layers are connected through a second via,
• the plurality of first ground layers and the plurality of second ground layers are disposed spaced apart,
• a third ground is provided between the first ground and the second ground,
• the third ground includes a plurality of third ground layers which are stacked, and the plurality of third ground layers are connected through a third via,
• one surface of the mounting substrate is provided with one of the third ground layers between one the first ground layers and one of the second ground layers,
• another surface of the mounting substrate is provided with one of the third ground layers and not provided with the first ground layers and the second ground layers, and
• the one surface of the mounting substrate is provided with a first resistance component to connect one of the first ground layers and one of the third ground layers, and a second resistance component to connect one of the second ground layers and the one of the third ground layers.

A blanking aperture array chip to be installed on a multi charged particle beam irradiation apparatus, the blanking aperture array chip comprising:

• a plurality of blankers provided for respective apertures through which beams in a multi charged particle beam pass, and configured to perform blanking deflection on the beams;
• a plurality of control circuits, each of which supplies a control signal to the blankers provided in each of a plurality of areas into which the blanking aperture array chip is divided;
• and
• a plurality of grounds, each of which is provided for a corresponding one of the plurality of control circuits and configured to supply a ground electrical potential to the corresponding control circuit,
• wherein the grounds corresponding to the control circuits are electrically separated from each other.

A blanking aperture array system to be installed on a multi charged particle beam irradiation apparatus, the blanking aperture array system comprising:

• a blanking aperture array chip provided with a plurality of blankers to perform blanking deflection for respective apertures through which beams in a multi charged particle beam pass;
• and
• a mounting substrate on which the blanking aperture array chip is mounted, the mounting substrate being provided with openings through which the multi charged particle beam passes,
• wherein the blanking aperture array chip and the mounting substrate are each provided with a plurality of control circuits a control signal to the blankers, and
• in each of the blanking aperture array chip and the mounting substrate, grounds corresponding to the control circuits are electrically separated from each other.