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US 12,640,326 B2Granted
Systems and methods for fabricating silicon die stacks for electron emitter array chips
OwnerUkyo Jeong, Ghiyuun Kanginventors
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Abstract
A chip mounted field emitter array method for their fabrication by applying sintering to bind a substrate die to other die layers. Metal powder is applied to the bonding surface of the die, covered with the chip carrier or chip and compressed between two heated plates. The bonding pads of the die may be conductively coupled to corresponding bonding pads of the other die layers.
Claims20
A chip mounted field emitter array comprising an integrated circuit chip and a substrate die,
- the integrated circuit chip comprising an emitter array chip comprising a chip base layer having a topside and an underside, an array of emission cone electrodes upon the topside of the chip base layer, a gate layer, metallic connecting pads, and a conductive coating on the underside of the chip base layer;
- and
- the substrate die comprising an insulating substrate layer having a conductively coated upper surface and at least one feed through electrical connector;
- and
- wherein the integrated circuit chip is attached to the substrate die via a sintered powder bonding layer.
2 more elements
A method for fabricating a field emitter array comprising:
- obtaining an integrated circuit chip having a metal coated base;
- obtaining a chip carrier having a metal coated upper side;
- obtaining a metal powder;
- applying a metal powder to the metal coated upper side of the chip carrier;
- covering the metal powder with the integrated circuit chip;
- compressing the integrated circuit chip and carrier between two heated plates.
3 more elements
Dependencies are inferred from the claim text.