Wire structure, wire capacitor including wire structure, and electronic device including wire capacitor
AssigneeSamsung Electronics Co., Ltd.
InventorsSoojae Park, Namhoon Kim, Jonghyun Lee, Chul-Hyung Cho
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Abstract
A wire capacitor includes a wire structure extending in a longitudinal direction and a conductive layer covering an outer surface of the wire structure. The wire structure includes a core electrode line having a wire shape and extending in the longitudinal direction and a dielectric line surrounding an outer surface of the core electrode line and extending in the longitudinal direction. The wire structure has a first end and a second end which are opposite to each other in the longitudinal direction, and the conductive layer exposes an outer circumference of the first end and the second end of the wire structure.
Claims19
A wire capacitor comprising:
- a wire structure extending in a longitudinal direction;
- and
- a conductive layer covering an outer surface of the wire structure,
- wherein the wire structure includes:
- a core electrode line having a wire shape and extending in the longitudinal direction;
- and
- a dielectric line surrounding an outer surface of the core electrode line and extending in the longitudinal direction,
- wherein the wire structure has a first end and a second end which are opposite to each other in the longitudinal direction,
- wherein the conductive layer exposes an outer circumference of the first end and the second end of the wire structure,
- wherein the conductive layer is configured to be connected to a first pad of a substrate associated with a semiconductor device, and
- wherein the first end of the wire structure is configured to be bonded to a second pad of the substrate.
An electronic device comprising:
- a substrate;
- and
- a wire capacitor electrically connected to the substrate,
- wherein the wire capacitor includes:
- a wire structure extending in a longitudinal direction;
- and
- a conductive layer covering an outer surface of the wire structure,
- wherein the wire structure includes:
- a core electrode line having a wire shape and extending in the longitudinal direction;
- and
- a dielectric line surrounding an outer surface of the core electrode line and extending in the longitudinal direction,
- wherein the wire structure includes a first end and a second end opposite to each other in the longitudinal direction,
- wherein the conductive layer exposes an outer circumference the first end and the second end of the wire structure,
- wherein the core electrode line is connected to the substrate by a wire bonding manner, at at least one of the first end and the second end of the wire structure, and
- wherein the conductive layer is electrically connected to the substrate.
A wire capacitor for use in a semiconductor device or semiconductor module, the wire capacitor comprising:
- a wire structure extending in a longitudinal direction;
- and
- a conductive layer covering an outer surface of the wire structure,
- wherein the wire structure includes:
- a core electrode line having a wire shape and extending in the longitudinal direction;
- and
- a dielectric line surrounding an outer surface of the core electrode line and extending in the longitudinal direction,
- wherein the wire structure has a first end and a second end which are opposite to each other in the longitudinal direction,
- wherein the conductive layer exposes an outer circumference of the first end and the second end of the wire structure,
- wherein the conductive layer is configured to be connected to a pad of a substrate, and
- wherein the first end and the second end of the wire structure each are configured to be bonded to a pad of the substrate.
Dependencies are inferred from the claim text.