Alignment system for semiconductor optical components of a LIDAR system

An alignment system for manufacturing a Light Detection and Ranging (LIDAR) system, comprising:

• an optical system, comprising:
• a first semiconductor optical component, and
• a second semiconductor optical component;
• a vacuum component configured to apply a suction force to the second semiconductor optical component;
• a fiber array unit coupled to the vacuum component and configured to be optically coupled to the second semiconductor optical component while the vacuum component applies the suction force to the second semiconductor optical component;
• and
• one or more processors configured to:
• control a transmission of light between the first semiconductor optical component and the fiber array unit via the second semiconductor optical component by:
• controlling the transmission of the light from the first semiconductor optical component to the fiber array unit via the second semiconductor optical component, or
• controlling the transmission of the light from the fiber array unit to the first semiconductor optical component via the second semiconductor optical component,
• measure the light transmitted between the first semiconductor optical component and the fiber array unit via the second semiconductor optical component, and
• control alignment of the first semiconductor optical component with the second semiconductor optical component based on the measured light.

A method for manufacturing a semiconductor-based LIDAR system for a vehicle, the method comprising:

• providing a first semiconductor optical component and a second semiconductor optical component;
• optically coupling a fiber array unit to the second semiconductor optical component;
• applying, by a vacuum component, a suction force to the second semiconductor optical component to couple the vacuum component to the second semiconductor optical component, wherein the fiber array unit is coupled to the vacuum component;
• aligning the first semiconductor optical component with the second semiconductor optical component based on a measurement of light transmitted between the first semiconductor optical component and the fiber array unit via the second semiconductor optical component;
• and
• after aligning the first semiconductor optical component with the second semiconductor optical component, controlling the vacuum component to release the suction force applied to the second semiconductor optical component by reducing the suction force by less than a threshold suction force reduction rate.