Semiconductor package and method of testing the same

A semiconductor package, comprising:

• a base film having a first mount surface, a folding surface, and a second mount surface that are sequentially arranged, the first mount surface, the folding surface, and the second mount surface together constituting a front surface of the base film;
• a first semiconductor chip disposed on the first mount surface of the base film;
• a second semiconductor chip disposed on the second mount surface of the base film;
• a plurality of connection patterns to which the first and second semiconductor chips are connected along the front surface of the base film;
• a plurality of test pads disposed on the folding surface of the base film;
• a plurality of test patterns through which the first and second semiconductor chips and the plurality of test pads are connected along the front surface of the base film;
• and
• a passivation layer disposed on the front surface of the base film, the passivation layer covering the plurality of connection patterns and the plurality of test patterns,
• wherein the folding surface has a first folding surface adjacent to the first mount surface and a second folding surface adjacent to the second mount surface, wherein the base film is folded such that the first folding surface and the second folding surface face each other and the first folding surface and the first mount surface are arranged in opposite directions, and
• wherein, on the first mount surface, the passivation layer exposes end portions of each of the plurality of connection patterns.