Method for grain boundary analysis of polycrystalline two-dimensional materials
AssigneeAjou University Industry-Academic Cooperation Foundation
InventorsJaehyun Lee, Jiyun Moon, Jun-Hui Choi, Seung-il Kim
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Abstract
The present disclosure relates to a method for analyzing a grain boundary of a polycrystalline two-dimensional material including transferring a polycrystalline two-dimensional material onto a substrate for analysis including a single crystalline two-dimensional material formed on a substrate; analyzing the polycrystalline two-dimensional material; depositing a metal thin film on the polycrystalline two-dimensional material; and exfoliating the polycrystalline two-dimensional material.
Claims10
A method for analyzing a grain boundary of polycrystalline two-dimensional materials, the method comprising:
- transferring a polycrystalline two-dimensional material onto a substrate for analysis, wherein a single crystalline two-dimensional material is formed on the substrate;
- analyzing the polycrystalline two-dimensional material;
- depositing a metal thin film on the polycrystalline two-dimensional material;
- and
- exfoliating the polycrystalline two-dimensional material,
- wherein a binding force of the metal thin film and the polycrystalline two-dimensional material is larger than a binding force of the polycrystalline two-dimensional material and the single crystalline two-dimensional material and is smaller than a binding force of the single crystalline two-dimensional material and the substrate.
A preparing method of a polycrystalline two-dimensional material in which a grain boundary analysis is completed, the method comprising:
- transferring a polycrystalline two-dimensional material onto a substrate for analysis, wherein a single crystalline two-dimensional material is formed on the substrate;
- analyzing the polycrystalline two-dimensional material;
- depositing a metal thin film on the polycrystalline two-dimensional material;
- and
- exfoliating the polycrystalline two-dimensional material,
- wherein a binding force of the metal thin film and the polycrystalline two-dimensional material is larger than a binding force of the polycrystalline two-dimensional material and the single crystalline two-dimensional material and is smaller than a binding force of the single crystalline two-dimensional material and the substrate.
Dependencies are inferred from the claim text.