Rail system for wafer transportation
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsGuancyun Li, Ching-Jung Chang
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsGuancyun Li, Ching-Jung Chang
Estimating the term…
The present disclosure provides a method to install a rail assembly according to different rail plans. A method according to the present disclosure includes assembling an overhead raceway module that includes a plurality of first level raceways extending along a first direction, and a plurality of second level raceways extending along a second direction perpendicular to the first direction, each of the plurality of second level raceways being fastened to the plurality of first level raceways, raising the overhead raceway module adjacent to a ceiling, installing the overhead raceway module to the ceiling, and fastening a rail assembly to the plurality of second level raceways, the rail assembly extending lengthwise along the first direction. A width of the overhead raceway module along the second direction is at least three times a width of the rail assembly along the second direction.
A method, comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.