Composite structure, resin film, and method of manufacturing resin film

A composite structure, comprising:

• a release carrier, wherein the release carrier includes:
• a release substrate;
• and
• a release resin layer formed on the release substrate, wherein the release resin layer covers the release substrate at a coverage rate of between 60% and 90%, wherein a material of the release resin layer includes silicone resin or fluorocarbon resin, and the release carrier contains 1 g/m2 to 5 g/m2 of the silicone resin or the fluorocarbon resin, wherein the release substrate has a plurality of concave parts and a plurality of convex parts, and the release resin layer is correspondingly arranged in the plurality of concave parts, so that the plurality of convex parts is exposed;
• and
• a resin film formed on the release carrier, wherein the resin film contacts both the release resin layer and the plurality of convex parts of the release substrate, and the resin film includes a resin and an agent, wherein the resin is polyurethane (PU), and the agent is selected form the group consisting of polyolefin resin, cycloolefin polymer (COP), cycloolefin copolymer (COC), a crosslinking agent, a UV absorber, and an antioxidant additive,
• wherein an air permeability of the release carrier is between 1 cfm and 15 cfm.