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US 12,637,560 B2Granted
Resin composition
AssigneesDupont Electronic Materials International, LLC, Dupont Electronics, Inc.
InventorsColin Hayes, Anton Chavez, Nora Sabina Radu, Jaclyn Murphy, Qing Min Wang, Tao Huang, Anton Li, Tanya N. Singh-Rachford, Michael Gallagher
Life of this patent
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Abstract
There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.
Claims14
A composition comprising:
- (a) 2-20 wt. % of one or more thermosetting resins;
- (b) 1-25 wt. % of one or more soluble polyimide resins;
- (c) 35-80 wt. % on one or more inorganic particulate fillers;
- and
- (d) 5-45 wt. % of one or more crosslinkers,
- wherein the wt. % ranges are with respect to the total solid weight of the composition, wherein the thermosetting resins comprise at least one arylcyclobutene resin;
- and the soluble polyimide resins are prepared from aromatic tetracarboxylic acid dianhydrides selected from the group consisting of 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), 4,4′-oxydiphthalic dianhydride (ODPA), 4,4′-bisphenol A dianhydride (BPADA) and 4,4′-(hexafluoro-isopropylidene) diphthalic anhydride (6FDA);
- and aromatic diamines selected from the group consisting of 2,2′-bis(trifluoromethyl) benzidine (TFMB) and 1,3-bis(3-aminophenoxy) benzene (APB-133).
5 more elements
Dependencies are inferred from the claim text.