Ligands for nano-sized materials
AssigneeSamsung Electronics Co., Ltd.
InventorsItai Lieberman, Manuel Hamburger, Christian Matuschek, Thomas Eberle, Beate Burkhart, Sebastian Meyer
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Abstract
The present invention relates to a compound suitable as ligand for binding to the surface of a semiconductor nanoparticle, said compound comprising an anchor group, a linker group and an organic functional group; a semiconductor nanoparticle have said ligand attached to the outermost particle surface; a composition, a formulation and a process for the preparation of said semiconductor nanoparticle; and an electronic device.
Claims17
A compound comprising, in the given order, an anchor group, AG, capable of binding to a surface of a semiconductor nanoparticle, followed by an electronically inert and conjugating interrupting linker group, L, followed by an organic functional group, FG,
- wherein group FG is an electron transporting group selected from the following groups
- wherein the dashed line represents the bonding position to the linker group,
- wherein the compound has a molecular weight of 1000 g/mol or less, and
- wherein the anchor group, AG, is selected from the group consisting of thiols or salts thereof, phosphonic acids or salts thereof, carboxylic acids or salts thereof, selenols or salts thereof, sulfinic acids or salts thereof, mercaptoesters or salts thereof, carbodithioic acids or salts thereof, boronic acids or salts thereof, and phosphines.
Dependencies are inferred from the claim text.