Hexagonal boron nitride powder and method for producing the same

Abstract

Provided is a hexagonal boron nitride powder capable of obtaining a resin composition excellent in solder heat resistance. The solder heat resistance of the resin composition can be improved by using a hexagonal boron nitride powder having a ratio (SW/SN) of a BET specific surface area (SW) measured using water as an adsorbed species to a BET specific surface area (SN) measured using nitrogen as an adsorbed species of 0.07 or less. In addition, by a method for producing a hexagonal boron nitride powder, including a step of heat-treating a coarse hexagonal boron nitride powder having an amount of eluted boron of 60 ppm or less at 1300° C. or higher and 2200° C. or lower in a nitrogen atmosphere having a dew point temperature of −85° C. or lower, a hexagonal boron nitride powder capable of improving the solder heat resistance of the resin composition can be obtained.

Dependencies are inferred from the claim text.