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US 12,636,874 B2Granted
Adhesive system
AssigneesDdp Specialty Electronic Materials, LLC, Dupont Materials Technology (Shanghai) Co., Ltd
InventorsYiqing Hu, Sergio Grunder
Life of this patent
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Abstract
Provided herein is a method for dissembling adhered substrates.
Claims6
An adhered assembly comprising:
- (1) a first substrate;
- (2) a second substrate;
- (3) a two-component polyurethane adhesive sandwiched between the first and second substrate;
- wherein a surface of at least one of the first substrate and the second substrate has a primer applied thereto prior to application of the adhesive, the primer comprising a film-forming resin having a softening temperature between 5° and 110° C.;
- and wherein the film-forming resin is a polyolefin modified with maleic anhydride.
2 more elements
An adhered assembly comprising:
- (1) a first substrate;
- (2) a second substrate;
- (3) a two-component polyurethane adhesive sandwiched between the first and second substrate;
- wherein a surface of at least one of the first substrate and the second substrate has a primer applied thereto prior to application of the adhesive, the primer comprising a film-forming resin having a softening temperature between 5° and 110° C., and
- wherein the film-forming resin is an epoxy resin based on bis-phenols.
2 more elements
Dependencies are inferred from the claim text.