Equipment for treating substrate including a chemical solution supply apparatus with pump member and extraction nozzle
AssigneeSemes Co., Ltd.
InventorsA Rah Cho, Woo Sin Jung, Hae Kyung Kim, Dae Sung Kim
Life of this patent
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Abstract
Provided is an equipment for treating a substrate. The substrate treating equipment may include: a nozzle supplying a chemical solution to a substrate; and a chemical solution supply apparatus supplying the chemical solution to the nozzle, and the chemical solution supply apparatus may include a pump member, an extraction nozzle provided on a flow path through which the chemical solution is introduced into the pump member and spraying the chemical solution by a spray scheme, and a control unit controlling an operation of the pump member.
Claims8
An equipment for treating a substrate, the equipment comprising:
- a nozzle configured to supply a chemical solution to a substrate;
- and
- a chemical solution supply apparatus configured to supply the chemical solution to the nozzle, wherein the chemical solution supply apparatus includes a pump member,
- an extraction nozzle in a flow path and configured to introduce the chemical solution into the pump member and spray the chemical solution, and
- a control unit configured to control an operation of the pump member, the controlling of the operation including selectively adjusting an internal volume of the pump member, wherein the extraction nozzle includes a nozzle body defining a central flow path through which the chemical solution flows formed therein, and the central flow path having a first cross-sectional area that is smaller than a second cross-sectional area of a pipe connected to the nozzle body such that a dissolved gas in the chemical solution is extracted in the form of bubbles, wherein the control unit is further configured to store the chemical solution in the pump member through the extraction nozzle,
- discharge the bubbles separated from the chemical solution in the pump member following the storing of the chemical solution, and eject the chemical solution from which the bubbles are removed from the pump member following the discharging of the bubbles, and wherein the control unit is configured to reduce the internal volume of the pump member by pressurizing the pump member while discharging the bubbles and ejecting the chemical solution.
An equipment for treating a substrate, the equipment comprising:
- a nozzle configured to supply a chemical solution to a substrate;
- and
- a chemical solution supply apparatus configured to supply the chemical solution to the nozzle,
- wherein the chemical solution supply apparatus includes
- a pump member,
- an extraction nozzle in a flow path and configured to introduce the chemical solution into the pump member, and
- a control unit configured to control an operation of the pump member, the controlling of the operation including selectively adjusting an internal volume of the pump member,
- wherein the extraction nozzle includes a nozzle body defining a central flow path through which the chemical solution flows formed therein, and
- the central flow path having a first cross-sectional area that is smaller than a second cross-sectional area of a pipe connected to the nozzle body such that a dissolved gas in the chemical solution is extracted in the form of bubbles,
- wherein the control unit is further configured to
- store the chemical solution in the pump member through the extraction nozzle,
- discharge the bubbles separated from the chemical solution in the pump member following the storing of the chemical solution, and
- eject the chemical solution from which the bubbles are removed from the pump member following the discharging of the bubbles, and
- wherein the control unit further includes a stabilization operation that allows the bubbles to be separated from the chemical solution between the storing of the chemical solution and the discharging of the bubbles.
Dependencies are inferred from the claim text.