Hand temperature monitoring device for chinese medicine diagnosis and treatment

A hand temperature monitoring device comprising at least one sensing array, wherein the at least one sensing array comprises:

• a flexible printed circuit board (110);
• a plurality of temperature sensors (120) disposed on a first side (112) of the flexible printed circuit board (110);
• a plurality of p-type metal-oxide semiconductor field-effect transistors (MOSFETs) (130) disposed on a second side (114) of the flexible printed circuit board (110) opposing to the temperature sensors (120), wherein each of the p-type MOSFETs (130) is electrically connected to one of the temperature sensors (120);
• a polymer film (140) caping each of the temperature sensors (120) and the p-type MOSFETs (130) respectively;
• and
• a carbon fiber board (150) positioned over the polymer film (140);
• wherein the carbon fiber board (150) comprises a solid resin film layer on one side and a dry fabric layer on the opposite side;
• wherein the solid resin film layer is disposed for making a full and intimate contact with a mould surface and the dry fabric layer is disposed for contacting with the polymer film (140) for further curing;
• wherein the dry fabric layer facilitates an air removal during a vacuum bag lamination process;
• wherein the mould is made based on a subject's palm and since the solid resin film layer is disposed for making a full and intimate contact with a mould surface during manufacturing, a personalized hand temperature monitoring device for the subject is provided;
• wherein the carbon fiber board (150) has a flexibility that matches with the flexible printed circuit board (110)'s flexibility so to function as a protector to the flexible printed circuit board (110) against external force, excessive bending, blocking sweat and grease permeation to electronic components disposed on the flexible printed circuit board (110);
• and
• where the carbon fiber board (150) has a thermal conductivity higher than copper so to function as a passive heat dissipation means to the flexible printed circuit board (110).