Chip package structure
AssigneeTong Hsing Electronic Industries, Ltd.
InventorsYu-Chiao Tseng, Chia-Min Wu, Yi-Ta Lai, Cheng-Yuan Wang, Szu-Yao Huang
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Abstract
A chip package structure includes a substrate, a chip, a light-permeable element, and an adhesive element. The chip is disposed on the substrate. The light-permeable element is disposed above the chip. The adhesive element is connected between the chip and the light-permeable element. The adhesive element surrounds the chip for formation of an accommodating space, and the chip is located in the accommodating space. The adhesive element includes two material layers having complementary visible light absorption spectra, such that the adhesive element is capable of being used to absorb full visible spectrum light.
Claims10
A chip package structure, comprising:
- a substrate;
- a chip disposed on the substrate;
- a light-permeable element disposed above the chip;
- and
- an adhesive element connected between the chip and the light-permeable element, wherein the adhesive element surrounds the chip for formation of an accommodating space, and the chip is located at the accommodating space;
- wherein the adhesive element includes two material layers having complementary visible light absorption spectra, such that the adhesive element is capable of being used to absorb full visible spectrum light.
Dependencies are inferred from the claim text.