Chip package having four sides provided with electromagnetic interference shielding layers and method of manufacturing the same

A method of manufacturing a chip package having four sides provided with electromagnetic interference (EMI) shielding layers correspondingly comprising the steps of:

• Step S1:
• providing a support board which includes a first surface, a second surface opposite to the first surface, and a plurality of a chip packages arranged in an array at the support board;
• the chip package is a rectangular body with four lateral sides and composed of a substrate, at least one first circuit layer, at least one second circuit layer, at least one chip, and an insulating layer;
• wherein the substrate consists of a first surface, a second surface opposite to the first surface, and four lateral sides;
• wherein at least one hole is formed and disposed on the first surface of the substrate;
• wherein each of the first circuit layer is disposed on the first surface of the substrate and extending to an inner surface of the hole of the substrate while each of the first circuit layer is provided with a first surface;
• wherein each of the second circuit layer is arranged at the second surface of the substrate;
• wherein each of the first circuit layer is extending to and electrically connected with each of the second circuit layer by the hole of the substrate;
• wherein the chip is electrically connected with and disposed on the first surface of each of the first circuit layer;
• wherein the insulating layer is mounted to the substrate, covering the chip, and provided with four lateral sides;
• each of the lateral sides of the insulating layer and each of lateral sides of the substrate are located on a same side correspondingly;
• wherein the chip is first electrically connected with the first surface of each of the first circuit layer electrically connected to each of the second circuit layer by each of the first circuit layer on the inner surface of the hole so that the chip is electrically connected outwards by each of the second circuit layer;
• wherein a cutting area is located between the two adjacent chip packages;
• Step S2:
• forming at least one slot on the cutting area of the support board and each of slot is penetrating from the first surface of the support board to the second surface of the support board;
• wherein each of slot is located on lateral side of the substrate and each of lateral side of the insulating layer of the chip package;
• Step S3:
• filling each of slot with a metal paste fully;
• and
• Step S4:
• cutting the support board along the cutting areas by using cutting tools to form a plurality of the chip packages;
• wherein a cutting channel whose width or diameter is smaller than a width or diameter of each of slot is formed on each of the cutting areas while a part of each of slot and a part of the metal paste are also removed along with formation of the cutting channel and a rest part of the metal paste not cut yet is left on an outer edge of the chip package to form at least one EMI shielding layer of the chip package;
• wherein each of EMI shielding layer is located on each of the lateral side of the chip package and covering each of lateral side of the substrate and each of lateral side of the insulating layer completely.