Embedding redistribution layer metal traces in a polymeric dielectric

A digital lithography system, comprising:

• a processing unit including a light source to deliver an electromagnetic radiation beam;
• a stage to support a substrate;
• and
• a system controller that is configured to control the digital lithography system to:
• selectively deliver, according to a digital transfer pattern, the electromagnetic radiation beam provided from the light source across one or more portions of an electromagnetic radiation sensitive layer that comprises a first photosensitive layer disposed on a surface of the substrate and a second photosensitive layer disposed on the first photosensitive layer, wherein
• delivering the electromagnetic radiation beam comprises providing the electromagnetic radiation beam at a plurality of different dosing levels,
• the first photosensitive layer has a first exposure sensitivity, and the second photosensitive layer has a second exposure sensitivity different from the first exposure sensitivity;
• and
• perform, after selectively delivering the electromagnetic radiation beam, a developing process on the first photosensitive layer and the second photosensitive layer to form a first set of features in the first photosensitive layer and a second set of features in the second photosensitive layer, the first set of features and the second set of features to be filled with a conductor during a deposition process.

A digital lithography system, comprising:

• a processing unit including a light source to deliver an electromagnetic radiation beam;
• a stage to support a substrate;
• and
• a computer readable medium storing instruction that when executed by a processor of the digital lithography system that includes the processing unit and the stage, cause the digital lithography system to:
• selectively deliver, according to a digital transfer pattern, the electromagnetic radiation beam provided from the light source across one or more portions of an electromagnetic radiation sensitive layer that comprises a first photosensitive layer disposed on a surface of the substrate and a second photosensitive layer disposed on the first photosensitive layer, wherein
• delivering the electromagnetic radiation beam comprises providing the electromagnetic radiation beam at a plurality of different dosing levels,
• the first photosensitive layer has a first exposure sensitivity, and the second photosensitive layer has a second exposure sensitivity different from the first exposure sensitivity;
• and
• perform, after selectively delivering the electromagnetic radiation beam, a developing process on the first photosensitive layer and the second photosensitive layer to form a first set of features in the first photosensitive layer and a second set of features in the second photosensitive layer, the first set of features and the second set of features to be filled with a conductor during a deposition process.