Substrate treatment method and substrate treatment device

A substrate processing apparatus comprising:

• a hydrophilic film forming liquid nozzle that supplies, toward a first surface of a substrate, a hydrophilic film forming liquid to form a hydrophilic film;
• a film thickness reducing liquid nozzle that supplies, toward the first surface of the substrate, a film thickness reducing liquid that dissolves the hydrophilic film to reduce a thickness of the hydrophilic film;
• a processing film forming liquid nozzle that supplies, toward the first surface of the substrate, a processing film forming liquid to form a processing film;
• a peeling liquid nozzle that supplies, toward the first surface of the substrate, a peeling liquid to peel off the processing film from the hydrophilic film;
• and
• a controller configured or programmed to control the substrate processing apparatus to perform operations comprising:
• supplying, via the hydrophilic film forming liquid nozzle, the hydrophilic film forming liquid towards the first surface of the substrate, wherein the first surface comprises a removal object having a particle diameter, wherein the hydrophilic film forming liquid forms the hydrophilic film on the first surface, and wherein the hydrophilic film has a thickness of a first value greater than the particle diameter of the removal object;
• supplying, via the film thickness reducing liquid nozzle, the film thickness reducing liquid towards the first surface of substrate, wherein the film thickness reducing liquid dissolves a portion of the hydrophilic film to reduce the thickness of the hydrophilic film from the first value to a second value smaller than the particle diameter of the removal object;
• supplying, via the processing film forming liquid nozzle and after the thickness of the hydrophilic film has been reduced to the second value, the processing film forming liquid to form, on a front surface of the hydrophilic film, the processing film such that the processing film holds the removal object;
• and
• supplying, via the peeling liquid nozzle, the peeling liquid toward the first surface of the substrate to peel off the processing film from the hydrophilic film.