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US 12,635,445 B2Granted
Device for drying semiconductor substrates
AssigneeSiltronic AG
InventorsSebastian Geissler, Simon Rothenaicher
Life of this patent
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Abstract
A device is for drying disc-shaped substrates. The device has an elongated body, which tapers upwards to form a wedge having an angle α between two surfaces and an upper edge. The upper edge is suitable for holding the disc-shaped substrates. The two surfaces have more than one hole, each forming channels, which extend to a lower drainage part of the elongated body.
Claims11
A device for drying disc-shaped substrates, the device comprising:
- an elongated body, which tapers upwards to form a wedge having an angle α between two surfaces and an upper edge,
- wherein the upper edge is suitable for holding the disc-shaped substrates, and
- wherein the two surfaces comprise more than one hole, each forming channels, which extend to a lower drainage part of the elongated body.
Dependencies are inferred from the claim text.