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US 12,635,319 B2Granted
Display module and manufacturing method therefor
AssigneeHcp Technology Co., Ltd.
InventorsXiaobo Zhou, Zhiqiang Huang, Wenrong Zhuang
Life of this patent
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Abstract
Disclosed are a display module and a manufacturing method therefor. The display module comprises: a substrate provided with an LED chip; an encapsulating layer for encapsulating the LED chip, wherein the encapsulating layer covers the substrate and the LED chip, and an ink color layer, which covers the encapsulating layer, wherein the surface roughness of the side of the ink color layer that faces away from the encapsulating layer is Ra<1 micron, and Rz<2 microns.
Claims8
A display module, comprising:
- a substrate provided with an LED chip;
- an encapsulation layer, wherein the encapsulation layer covers the substrate and the LED chip;
- an ink color layer, wherein the ink color layer covers the encapsulation layer, and a side of the ink color layer facing away from the encapsulation layer has a surface roughness which satisfies Ra<1 micron, and Rz<2 microns;
- and
- an imaging layer, wherein the imaging layer covers the ink color layer, and a side of the imaging layer facing away from the ink color layer has a surface roughness which satisfies Ra<2 microns, and Rz<4 microns.
2 more elements
A manufacturing method for a display module, comprising:
- forming an encapsulation layer on a substrate and on a LED chip on the substrate;
- forming an ink color layer on the encapsulation layer;
- and
- planarizing a surface of the ink color layer;
- wherein a side of the ink color layer facing away from the encapsulation layer has a surface roughness which satisfies Ra<1 micron, and Rz<2 microns;
- forming an imaging layer on the ink color layer;
- and
- planarizing a surface of the imaging layer, wherein a side of the imaging layer facing away from the ink color layer has a surface roughness which satisfies Ra<2 microns, and Rz<4 microns.
5 more elements
Dependencies are inferred from the claim text.