Semiconductor packages with reliable covers

A semiconductor package comprising:

• a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes a die region;
• a die attached to the die region, the die includes
• a first major die surface, the first major die surface includes
• a sensor region with a sensor, and
• a cover adhesive region surrounding the sensor region;
• a second major die surface, the second major die surface is attached to the die region of the top major package substrate surface;
• a cover structure unit attached to the first major die surface, the cover structure unit includes top and bottom major cover structure unit surfaces and side cover structure unit surfaces, the cover structure unit comprises
• a primary cover structure, the primary cover structure includes top and bottom major primary cover structure surfaces and side primary cover structure surfaces,
• a secondary cover structure surrounding the primary cover structure and in direct contact with at least the side primary cover structure surfaces, the primary and secondary cover structures are an integrated unit to form the cover structure unit, the secondary cover structure is configured to protect the primary cover structure from damage during packaging to form the semiconductor package, wherein outer secondary cover structure side surfaces form the side cover structure unit surfaces,
• a top secondary cover structure surface and the top major primary cover structure surface form the top major cover structure unit surface, and
• a bottom secondary cover structure surface and the bottom major primary cover structure surface form the bottom major cover structure unit surface, and
• a cover bond region on the bottom major cover structure unit surface, the bottom major cover structure unit surface faces the die;
• a cover adhesive contacts the cover adhesive region on the first major die surface and the cover bond region on the bottom major cover structure unit surface, the cover adhesive is configured to attach the cover structure unit to the die and to form a sealed cavity between the cover structure unit and the sensor region;
• and
• an encapsulant, the encapsulant covers exposed portions of the package substrate, the die and bond wires and at least a portion of the side cover structure unit surfaces while leaving the top major cover structure unit surface exposed.