Three-dimensional columnar input-output (IO) circuitry for integrated circuit device
AssigneeAltera Corporation
InventorsMahesh K. Kumashikar, Ankireddy Nalamalpu, Atul Maheshwari, Lai Guan Tang
Life of this patent
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Abstract
This disclosure is directed to methods of disaggregating columnar IO operations from a programmable logic fabric using 3-D packaging technology. More specifically, methods of 3-D programmable fabric arrangements that include one or more IO chiplets stacked in a 3-D orientation on a programmable logic fabric main die that includes one or more D2D drivers to enable communication between the one or more IO chiplets and the programmable logic fabric main die. The IO chiplets may be coupled to the programmable fabric main die through connection to the one or more D2D drivers arranged on the programmable fabric main die.
Claims20
A system comprising:
- one or more input/output (IO) chiplets;
- a programmable fabric main die, wherein the one or more IO chiplets are stacked in a three-dimensional orientation above or below the programmable fabric main die, and wherein the programmable fabric main die comprises:
- one or more die-to-die (D2D) drivers embedded within the programmable fabric main die, wherein the one or more D2D drivers interface with the one or more IO chiplets;
- and
- a plurality of sectors associated with logic of the programmable fabric main die, wherein a location of the one or more D2D drivers within a sector of the plurality of sectors of the programmable fabric main die is based on logic of the sector of the plurality of sectors.
A programmable fabric main die, wherein one or more IO chiplets are stacked in a three-dimensional orientation above or below the programmable fabric main die, and wherein the programmable fabric main die comprises:
- one or more die-to-die (D2D) drivers embedded within the programmable fabric main die, wherein the one or more D2D drivers interface with the one or more IO chiplets;
- and
- a plurality of sectors associated with logic of the programmable fabric main die, wherein some sectors of the plurality of sectors are connected to a greater number of IO chiplets than other sectors of the plurality of sectors.
An integrated circuit comprising:
- one or more input/output (IO) chiplets;
- a programmable fabric main die, wherein the one or more IO chiplets are stacked in a three-dimensional orientation above or below the programmable fabric main die, and wherein the programmable fabric main die comprises:
- one or more die-to-die (D2D) drivers embedded within the programmable fabric main die, wherein the one or more D2D drivers interface with the one or more IO chiplets;
- and
- a plurality of sectors associated with logic of the programmable fabric main die, wherein a location of the one or more D2D drivers within a sector of the plurality of sectors of the programmable fabric main die is based on logic of the sector of the plurality of sectors.
Dependencies are inferred from the claim text.