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US 12,633,901 B2Granted
Surface acoustic wave resonator and multiplexer including the same
AssigneeRF360 Singapore Pte. Ltd.
InventorsMatthias Knapp, Christian Huck
Life of this patent
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Abstract
A surface acoustic wave resonator (100) comprises a layered substrate including a carrier substrate (110) and a dielectric layer (112) having a low acoustic velocity. Another dielectric layer (122) is disposed on a piezoelectric layer (113) and interdigitated electrodes (131, 132) having an acoustic velocity lower than the acoustic velocity of the carrier substrate (110) and a positive temperature coefficient of frequency.
Claims17
A surface acoustic wave resonator, comprising:
- a layered substrate, comprising:
- a carrier substrate having an acoustic velocity;
- a first dielectric layer having an acoustic velocity lower than the acoustic velocity of the carrier substrate, the first dielectric layer disposed on the carrier substrate;
- a piezoelectric layer disposed on the first dielectric layer;
- interdigitated electrodes disposed on the piezoelectric layer;
- and
- a second dielectric layer having an acoustic velocity lower than the acoustic velocity of the carrier substrate and having a positive temperature coefficient of frequency, the second dielectric layer disposed on the piezoelectric layer and on the interdigitated electrodes,
- wherein the interdigitated electrodes comprise a plurality of fingers having a pitch related to a wavelength, and
- wherein a height of the second dielectric layer is between 5% and 15% of a height of the piezoelectric layer.
6 more elements
A RF multiplexer circuit, comprising:
- a first port to be coupled to an antenna;
- a second port to be coupled to a transmit circuit and a transmit filter circuit coupled between the first and second ports;
- and
- a third port to be coupled to a receive circuit and a receive filter circuit coupled between the first and third ports, wherein transmit and receive filter circuits each include resonators, and wherein a first resonator of the resonators comprises:
- a layered substrate, comprising:
- a carrier substrate having an acoustic velocity;
- a first dielectric layer having an acoustic velocity lower than the acoustic velocity of the carrier substrate, the first dielectric layer disposed on the carrier substrate;
- a piezoelectric layer disposed on the first dielectric layer;
- interdigitated electrodes disposed on the piezoelectric layer;
- and
- a second dielectric layer having an acoustic velocity lower than the acoustic velocity of the carrier substrate and having a positive temperature coefficient of frequency,
- wherein the interdigitated electrodes comprise a plurality of fingers having a pitch related to a wavelength, and
- wherein a height of the second dielectric layer is between 5% and 15% of a height of the piezoelectric layer.
10 more elements
Dependencies are inferred from the claim text.