Modular and adjustable thermal load test vehicle

A device for simulating thermal loads, the device comprising:

• a platform;
• a stage affixed to the platform, a portion of the stage being moveable horizontally relative to the platform;
• and
• a plurality of thermal nodes coupled with the platform, the plurality of thermal nodes configured to simulate a size or shape of a component of a chip or multi-chip module design, wherein a thermal node of the plurality of thermal nodes is affixed to the moveable portion of the stage and is configured to provide a thermal flux at a top surface of the thermal node.

A device for simulating thermal loads, the device comprising:

• a platform;
• a stage including at least a first substage and a second substage, wherein the first substage is movable horizontally relative to the second substage, and the second substage is affixed to the platform;
• a node of a plurality of nodes affixed to the first substage so as to be movable relative to the second substage, wherein the plurality of nodes are configured to simulate a size or shape of a component of a chip or multi-chip module design;
• and
• a thermal source connected to the node and configured to transfer thermal energy between the thermal source and a top surface of the node.