Wireless high-temperature probe with time-multiplexed NTC leads and manufacturing method thereof

A manufacturing method of a wireless high-temperature probe, comprising following steps:

• inserting a printed circuit board assembly (PCBA) into a metal probe tube, so that a probe end of a lead-type temperature sensor is located at a tip of the metal probe tube and positive spring contacts are in contact with an inner wall of the metal probe tube, and wrapping the PCBA in a thermal pad,
• press-fitting a ceramic insulating ring with an end of the metal probe tube and a front end of a coaxial coupling shaft successively, and forming an insulated and sealed structure after curing,
• inserting a stepped-down end section of the PCBA into a small-diameter tube section of the coaxial coupling shaft, to bring a negative spring contact into contact with an inner wall of the coaxial coupling shaft to form electrical conduction, and securing a relative location between the coaxial coupling shaft and the PCBA by welding, and
• guiding an extension section of leads of an ambient temperature sensor through an inner cavity of the coaxial coupling shaft and in close contact with an inner wall of a ceramic handle, applying adhesive onto an assembly surface of the coaxial coupling shaft and the ceramic handle, and forming a multi-seal structure after curing.